Process characteristics of reflow soldering compared with wave soldering

Lead-free wave soldering and lead-free reflow soldering are necessary soldering equipment for the production of electronic products. Lead-free wave soldering is used to solder active plug-in electronic components, and lead-free reflow soldering is used to solder source pin electronic components. For devices, lead-free reflow soldering is also a type of SMT production process. Next, Chengyuan Automation will share with you the characteristics of the lead-free reflow soldering process compared with lead-free wave soldering.

1. The lead-free reflow soldering process is not like lead-free wave soldering, which requires the components to be directly immersed in the molten solder, so the thermal shock to the components is small. However, due to different heating methods for lead-free reflow soldering, greater thermal stress is sometimes exerted on components;

2. The lead-free reflow soldering process only needs to apply solder on the pad, and can control the amount of solder applied, avoiding the occurrence of welding defects such as virtual soldering and continuous soldering, so the welding quality is good and the reliability is high;

3. The lead-free reflow soldering process has a self-positioning effect. When the component placement position deviates, due to the surface tension of the molten solder, when all the soldering terminals or pins and the corresponding pads are wetted at the same time, the surface will Under the action of tension, it is automatically pulled back to the approximate target position;

4. There will be no foreign substances mixed into the solder of the lead-free reflow soldering process. When using solder paste, the composition of the solder can be correctly ensured;

5. The lead-free reflow soldering process can use local heating sources, so that different soldering processes can be used for soldering on the same circuit board;

6. The lead-free reflow soldering process is simpler than the lead-free wave soldering process, and the workload of board repair is small, thus saving manpower, electricity and materials.